Fig. 2From: Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnectsOriginal Voronoi Tessellation (blue) generated within 1Â ÎĽm x 1Â ÎĽm area and (Cu metal) limited Voronoi Tessellation (red) forming the polycrystalline metal structure. Dimensions are in micronsBack to article page