Fig. 5From: Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnectsYY component of node stress levels obtained post the thermal stress: a crystalline Cu metal structure with isotropic elastic constants and b polycrystalline Cu with grain orientation dependent elastic anisotropy. (Note that this is a tilted view of a 3D structure, showing only stress levels in copper while hiding other materials in test structures)Back to article page