Skip to main content
Fig. 5 | Mechanics of Advanced Materials and Modern Processes

Fig. 5

From: Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects

Fig. 5

YY component of node stress levels obtained post the thermal stress: a crystalline Cu metal structure with isotropic elastic constants and b polycrystalline Cu with grain orientation dependent elastic anisotropy. (Note that this is a tilted view of a 3D structure, showing only stress levels in copper while hiding other materials in test structures)

Back to article page