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Table 1 Materials data of s-glass (I), e-glass (II), and aramid (III) fibers and epoxy matrix

From: Computational study for reliability improvement of a circuit board

 

S-glass (I)

E-glass (II)

Aramid (III)

Epoxy

Ply I

Ply II

Ply III

E 11 in GPa

85

65

100

4.2

53

41

62

E 22 in GPa

85

65

5.4

4.2

9.8

9.6

4.9

ν 21

0.23

0.20

0.37∗

0.34

0.27

0.26

0.36

ν 23

0.4∗

0.4∗

0.4∗

0.34

0.44

0.44

0.44

G 12 in GPa

33

28

1.5∗

1.6

3.7

3.6

1.5

α 11 in μm/(m K)

1.5

4

–3

45

2.9

5.7

–2.2

α 22 in μm/(m K)

1.5

4

17

45

18.9

20.4

28.2

α 33 in μm/(m K)

1.5

4

17

45

18.9

20.4

28.2

  1. Parameters marked with ∗ are approximated values
  2. Calculated unidirectional plies with s-glass, e-glass, and aramid are denoted by Ply I, II, and III, respectively