From: Computational study for reliability improvement of a circuit board
S-glass (I) | E-glass (II) | Aramid (III) | Epoxy | Ply I | Ply II | Ply III | |
---|---|---|---|---|---|---|---|
E 11 in GPa | 85 | 65 | 100 | 4.2 | 53 | 41 | 62 |
E 22 in GPa | 85 | 65 | 5.4 | 4.2 | 9.8 | 9.6 | 4.9 |
ν 21 | 0.23 | 0.20 | 0.37∗ | 0.34 | 0.27 | 0.26 | 0.36 |
ν 23 | 0.4∗ | 0.4∗ | 0.4∗ | 0.34 | 0.44 | 0.44 | 0.44 |
G 12 in GPa | 33 | 28 | 1.5∗ | 1.6 | 3.7 | 3.6 | 1.5 |
α 11 in μm/(m K) | 1.5 | 4 | –3 | 45 | 2.9 | 5.7 | –2.2 |
α 22 in μm/(m K) | 1.5 | 4 | 17 | 45 | 18.9 | 20.4 | 28.2 |
α 33 in μm/(m K) | 1.5 | 4 | 17 | 45 | 18.9 | 20.4 | 28.2 |