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Table 1 Materials data of s-glass (I), e-glass (II), and aramid (III) fibers and epoxy matrix

From: Computational study for reliability improvement of a circuit board

  S-glass (I) E-glass (II) Aramid (III) Epoxy Ply I Ply II Ply III
E 11 in GPa 85 65 100 4.2 53 41 62
E 22 in GPa 85 65 5.4 4.2 9.8 9.6 4.9
ν 21 0.23 0.20 0.37 0.34 0.27 0.26 0.36
ν 23 0.4 0.4 0.4 0.34 0.44 0.44 0.44
G 12 in GPa 33 28 1.5 1.6 3.7 3.6 1.5
α 11 in μm/(m K) 1.5 4 –3 45 2.9 5.7 –2.2
α 22 in μm/(m K) 1.5 4 17 45 18.9 20.4 28.2
α 33 in μm/(m K) 1.5 4 17 45 18.9 20.4 28.2
  1. Parameters marked with are approximated values
  2. Calculated unidirectional plies with s-glass, e-glass, and aramid are denoted by Ply I, II, and III, respectively