From: Computational study for reliability improvement of a circuit board
Lam. I
Lam. II
Lam. III
trace
via
ă€ˆ p ε〉 in %
0.409
0.282
0.318
0.236
0.262
0.204
N f.
8 760
16 279
13 325
21 903
18 402
27 924