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Table 4 Number of failure calculated by the accumulated plastic strain in each cycle for three different laminates

From: Computational study for reliability improvement of a circuit board

  Lam. I Lam. II Lam. III
  trace via trace via trace via
p ε〉 in % 0.409 0.282 0.318 0.236 0.262 0.204
N f. 8 760 16 279 13 325 21 903 18 402 27 924